Design and Manufacturing
  • Chip & Wire Hybrids
  • Multi Chip Modules
  • Surface Mount Hybrids
  • Chip On Board
  • Power Hybrids
  • Custom Packaging
Sealing
  • Seam Seal
  • Cap Welding
  • Ceramic Lid/Epoxy
  • Glob Top
Substrates
  • Thick Film - Alumina, BeO, AlN
  • Thin Film - Alumina, BeO
  • Direct Bond Copper
  • Polyimide, G10, Flex
Electrical Testing
  • DC & AC Testing
  • Temperature Testing
  • Data Recording
Assembly
  • Die Attachment; Epoxy, Solder, Eutectic
  • Wirebonding; Gold & Aluminum, 1 to 20 mils
  • Surface Mount
Screening
  • Acceleration
  • Temperature Testing
  • Hermetic; Fine and Gross
  • Burn In
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sanchez hybrid microelectronics
439 south union st. lawrence, ma 01843
tel: 978.688.1299 fax: 978.688.1399
email:
info@sanchez-hybirdmicroelectronics.com